Company Category: Printed & Additive Electronics

Uyemura International

The Uyemura-MEC roadmap for max HD/UHDI yields includes Etchbond micro-roughening, anisotropic etchants for sub-40 micro circuitry patterns and differential and flash etchants for mSAP/SAP. Talon 3 electroless phos palladium and TPD-23 pure palladium are foundational for ENEPIG, EPIG, EPAG final finishes. Direct immersion gold meets highest standards for HF and fine pattern compatibility. TWX-42 deposits 6-8 µm gold. For the substrate market, Uyemura introduces direct glass metallization, electrolytes including electroless copper, copper thru-glass via, RDL plating, copper post-plating and tin | Uyemura displays Niphos 6500, which plates twice as fast as conventional electrolytic nickel processes while maintaining the same level of phosphorus in the plated layer. Developed to eliminate “bottlenecks” on R2R lines; also available for rack/barrel processing. 6500 has a phosphorus content of 6-11%, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection. Also: C100 silver graphite dispersion lowers silver thickness, producing significant cost savings. Retains silver’s conductive properties, protects against tarnish, friction, wear. Excellent conductivity and superior resistance to fretting corrosion, oxidation, vibration, heat. Friction trace tests indicate low abrasion and no wear-through.

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Taiyo America

Taiyo America, Inc. is a manufacturing subsidiary of the Japan-based Taiyo Holdings Co., Ltd., and is a Global leader in the production of solder mask and related materials for the printed circuit board (PCB) industry. Taiyo Circuit Automation, Inc. (TCA) is a specialized manufacturing subsidiary of Taiyo America, Inc., established in 2020 after the acquisition of Circuit Automation, Inc. It serves as the equipment-focused arm of the global Taiyo group, providing coating and curing solutions that complement Taiyo’s dominant solder mask chemical products.

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Stec Co., Ltd.

Stec Co.,Ltd. is an equipment manufacturer based in Shimane, Japan. We design and manufacture plasma surface modification systems and various factory automation (FA) devices. At this exhibition, we are showcasing our proprietary “Mild Plasma” technology—a unique plasma surface treatment method. It significantly improves the adhesion of hard-to-bond materials and enables integration of dissimilar materials.

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Remtec

Founded in 1990 and serving customers worldwide from our headquarters in Canton, MA – Remtec offers advanced and high-performance ceramic packaging technology, substrates, circuit boards, and assembly components utilized across the electronics industry. Our solutions are particularly well-suited for challenging high-power, high-circuit-density, and mission-critical applications, and can be applied across a broad range of frequencies. US-based, ITAR compliant, and ISO-certified. | Remtec solves electronic packaging challenges through product innovations like our proprietary Plated Copper Thick Film (PCTF®) ceramic metallization and packaging technology, through industry-leading manufacturing techniques at our modern US-based facility. Remtec engineers work closely with each customer to develop the most cost-effective manufacturing techniques for their specific requirements.

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nScrypt

nScrypt designs and manufactures precision microdispensing and direct digital manufacturing solutions for today’s most demanding electronics and advanced manufacturing applications. From electronics packaging, adhesive/solder dispensing, and factory automation, nScrypt systems deliver unmatched accuracy, flexibility, and reliability—helping innovators prototype faster, scale smarter, and build what others can’t.

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MicroCraft

MicroCraft leads in product advancement and customer satisfaction through technological development. The EMMA series moving probe testers set the industry standard for electrical testing. The SARRA Series TDR & VNA measurement systems place MicroCraft at the forefront of impedance and signal-integrity measurement for high-speed designs. MicroCraft’s CraftPix series inkjet printers digitize printing of solder mask, etch resist, and conductive inks while reducing manufacturing time and cost. MicroCraft continues to drive innovation for the next generation of electronics.

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MicroCare, LLC

Global manufacturer of cleaning products for electronics assembly engineered for cleaning PCBs and equipment on the SMT assembly line including Flux Removers, Degreasers, Dust Removers, Presaturated Wipes and more. Manufacturers worldwide rely on our products to remove fluxes, pastes, oils and coatings quickly and inexpensively. We offer quality cleaning products backed by a strong sales and technical team to help you Discover Perfectly Clean. | MicroCare offers high-performance precision parts cleaning and debinding fluids designed for vapor degreasing. Our solutions, including Tergo™ PFAS-Free and MicroCare Engineered Fluids, provide 3M™ Novec™ alternatives that deliver exceptional cleaning power while meeting evolving environmental and regulatory standards. Many of our fluids are environmentally progressive, fast-drying, non-flammable, and globally compliant, ensuring safe and effective cleaning for critical applications. Tergo PFAS-Free offers an innovative, sustainable solution without compromising performance, helping manufacturers transition seamlessly from legacy chemistries. Whether removing flux, oils, particulates, or binder residues, MicroCare Engineered Fluids optimize cleaning processes while improving reliability and efficiency. Backed by expert technical support, we help businesses maintain compliance and operational excellence. Schedule a consultation today.

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Insulectro

Insulectro supplies advanced engineered materials manufactured by EMC, Arlon, Qnity, LCOA™, CAC, Inc., Pacothane, Electroninks, FOCUSTECH™, JX Metals Corporation, TADCO, AIT (Ormet®), Shikoku, ETI, Industrial Brush Corporation, Kyocera SGS Precision Tools, and InduBond®. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data com, high-speed computing, mobile devices, military, and medical.

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Heller Industries

MK5/7 model with the lowest Nitrogen and electrical consumption! NEW Flux Separation System provides Maintenance Free operation with Self Cleaning mode maximizes up-time and generates more revenue! 100% Forced Convection Reflow Soldering and Curing systems are Lead Free compliant and provides the best Delta T and lowest cost of ownership available.

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Essemtec AG

Essemtec is a leader in flexible surface-mount technology (SMT) solutions, offering advanced pick-and-place systems as well as dedicated dispensing and high-speed jetting platforms. With a strong focus on integrated All-in-One production concepts, Essemtec supports high-mix, low- to medium-volume manufacturing and demanding dispensing applications. The portfolio ranges from pure dispensing and jetting systems to versatile All-in-One platforms combining placement, dispensing, and inspection, complemented by smart material management solutions and the Lizard reflow oven. Our Focus–Your Solution

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