About

About Remtec About Remtec, Inc. Remtec solves electronic packaging challenges through product innovations like our proprietary Plated Copper Thick Film (PCTF®) ceramic metallization and packaging technology, through industry-leading manufacturing techniques at our modern US-based facility. Remtec engineers work closely with each customer to develop the most cost-effective manufacturing techniques for their specific requirements. Founded in 1990 and serving customers worldwide from our headquarters in Canton, MA – Remtec offers advanced and high-performance ceramic packaging technology, substrates, circuit boards, and assembly components utilized across the electronics industry. Our solutions are particularly well-suited for challenging high-power, high-circuit-density, and mission-critical applications, and can be applied across a broad range of frequencies. US-based, ITAR compliant, and ISO-certified. Remtec solves electronic packaging challenges through product innovations like our proprietary Plated Copper Thick Film (PCTF®) ceramic metallization and packaging technology, through industry-leading manufacturing techniques at our modern US-based facility. Remtec engineers work closely with each customer to develop the most cost-effective manufacturing techniques for their specific requirements.