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About Uyemura International Corp About Uyemura International The Uyemura-MEC roadmap for max HD/UHDI yields includes Etchbond micro-roughening, anisotropic etchants for sub-40 micro circuitry patterns and differential and flash etchants for mSAP/SAP. Talon 3 electroless phos palladium and TPD-23 pure palladium are foundational for ENEPIG, EPIG, EPAG final finishes. Direct immersion gold meets highest standards for HF and fine pattern compatibility. TWX-42 deposits 6-8 µm gold. For the substrate market, Uyemura introduces direct glass metallization, electrolytes including electroless copper, copper thru-glass via, RDL plating, copper post-plating and tin Uyemura displays Niphos 6500, which plates twice as fast as conventional electrolytic nickel processes while maintaining the same level of phosphorus in the plated layer. Developed to eliminate “bottlenecks” on R2R lines; also available for rack/barrel processing. 6500 has a phosphorus content of 6-11%, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection. Also: C100 silver graphite dispersion lowers silver thickness, producing significant cost savings. Retains silver’s conductive properties, protects against tarnish, friction, wear. Excellent conductivity and superior resistance to fretting corrosion, oxidation, vibration, heat. Friction trace tests indicate low abrasion and no wear-through.