Vesta Microsystem is dedicated to developing & enabling IP-owned iTGV technology into semiconductor advanced packaging sector by high-accuracy & UPH LIDE (Laser Induced Deep Etching) hole, Direct-Cu microvia metallization (aspect ratio : ~10) & fine line RDLs and also committed to act as a partnered solution provider of semiconductor iTGV substrate. Why Vesta iTGV ? – Leading LIDE Through Hole Formation (accu. +/- 2um ; > 80% straight hole) – Quasi-Isotropic Conformal Coverage(PVD) for High AR Hole (~10) – SeWaRe (glass cracking) Prevention – Total Solution for Dense RDLs Built on iTGV Core
Uyemura International
The Uyemura-MEC roadmap for max HD/UHDI yields includes Etchbond micro-roughening, anisotropic etchants for sub-40 micro circuitry patterns and differential and flash etchants for mSAP/SAP. Talon 3 electroless phos palladium and TPD-23 pure palladium are foundational for ENEPIG, EPIG, EPAG final finishes. Direct immersion gold meets highest standards for HF and fine pattern compatibility. TWX-42 deposits 6-8 µm gold. For the substrate market, Uyemura introduces direct glass metallization, electrolytes including electroless copper, copper thru-glass via, RDL plating, copper post-plating and tin | Uyemura displays Niphos 6500, which plates twice as fast as conventional electrolytic nickel processes while maintaining the same level of phosphorus in the plated layer. Developed to eliminate “bottlenecks” on R2R lines; also available for rack/barrel processing. 6500 has a phosphorus content of 6-11%, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection. Also: C100 silver graphite dispersion lowers silver thickness, producing significant cost savings. Retains silver’s conductive properties, protects against tarnish, friction, wear. Excellent conductivity and superior resistance to fretting corrosion, oxidation, vibration, heat. Friction trace tests indicate low abrasion and no wear-through.
Stec Co., Ltd.
Stec Co.,Ltd. is an equipment manufacturer based in Shimane, Japan. We design and manufacture plasma surface modification systems and various factory automation (FA) devices. At this exhibition, we are showcasing our proprietary “Mild Plasma” technology—a unique plasma surface treatment method. It significantly improves the adhesion of hard-to-bond materials and enables integration of dissimilar materials.
Practical Components
Practical Components, the leading supplier of Dummy Components, Test Boards, and Training Aids, supplies the fuel that drives the electronics industry. Our products enable engineers, manufacturers, and educators to test, train, and refine processes safely and accurately. Designed to replicate real-world components and assemblies, our solutions support machine setup, process development, inspection training, and hands-on learning. Practical Components provides the foundation that allows innovation to happen, fueling the electronics industry in practice, not just in theory.
Kaston Co., Ltd.
Founded in 2010, Kaston Co., Ltd. has 3 locations, with more than 10 agents marketing throughout the world！ Through working globally, we currently work with trades in fields such as Semi-conductors, metals, mechanical, chemical, daily product etc. With a wide range of business with different industries, trade and marketing, we also work with the assistance from our partners from all over the world, we are constantly and actively developing, producing and manufacturing fabricated products.
Elephantech Inc
Elephantech Inc. is a Tokyo-based deep-tech company pioneering copper nanoparticle materials and inkjet-based additive manufacturing. At IPC APEX, Elephantech highlights three core technologies: Self-Assembled Copper Nanoparticles (SA-CuNP) that enable high-performance copper pastes without organic dispersants; a novel HDI microvia formation process using copper nanoparticle ink and reduction, delivering palladium-free, void-free vias; and SustainaCircuits™, a pure additive PCB manufacturing platform supported by ELP04 inkjet equipment for low-carbon, high-density PCB production.