The Uyemura-MEC roadmap for max HD/UHDI yields includes Etchbond micro-roughening, anisotropic etchants for sub-40 micro circuitry patterns and differential and flash etchants for mSAP/SAP. Talon 3 electroless phos palladium and TPD-23 pure palladium are foundational for ENEPIG, EPIG, EPAG final finishes. Direct immersion gold meets highest standards for HF and fine pattern compatibility. TWX-42 deposits 6-8 µm gold. For the substrate market, Uyemura introduces direct glass metallization, electrolytes including electroless copper, copper thru-glass via, RDL plating, copper post-plating and tin | Uyemura displays Niphos 6500, which plates twice as fast as conventional electrolytic nickel processes while maintaining the same level of phosphorus in the plated layer. Developed to eliminate “bottlenecks” on R2R lines; also available for rack/barrel processing. 6500 has a phosphorus content of 6-11%, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection. Also: C100 silver graphite dispersion lowers silver thickness, producing significant cost savings. Retains silver’s conductive properties, protects against tarnish, friction, wear. Excellent conductivity and superior resistance to fretting corrosion, oxidation, vibration, heat. Friction trace tests indicate low abrasion and no wear-through.
T-Tech, Inc.
T-Tech, Inc. has evolved into the nation’s leading manufacturer of printed circuit board prototyping systems with thousands of systems in the field. Our customers range from some of the world’s largest corporations and research institutions to small businesses. With clients in over 46 countries, T-Tech, Inc. has developed a worldwide reputation for precision, quality, and service.
Stec Co., Ltd.
Stec Co.,Ltd. is an equipment manufacturer based in Shimane, Japan. We design and manufacture plasma surface modification systems and various factory automation (FA) devices. At this exhibition, we are showcasing our proprietary “Mild Plasma” technology—a unique plasma surface treatment method. It significantly improves the adhesion of hard-to-bond materials and enables integration of dissimilar materials.
Elephantech Inc
Elephantech Inc. is a Tokyo-based deep-tech company pioneering copper nanoparticle materials and inkjet-based additive manufacturing. At IPC APEX, Elephantech highlights three core technologies: Self-Assembled Copper Nanoparticles (SA-CuNP) that enable high-performance copper pastes without organic dispersants; a novel HDI microvia formation process using copper nanoparticle ink and reduction, delivering palladium-free, void-free vias; and SustainaCircuits™, a pure additive PCB manufacturing platform supported by ELP04 inkjet equipment for low-carbon, high-density PCB production.
ChemCubed
At ChemCubed, we recognize the universal presence of printed circuit boards (PCBs) in today’s world, yet we acknowledge the limitations imposed by the reliance on 20th-century manufacturing techniques. Our commitment to innovation drives us to address the challenges faced in the production process, particularly in Additive Manufacturing Electronics (AME).
ASYS Group Americas Inc
The ASYS Group is one of the world’s leading suppliers in the field of automation and digitalization. As a technology leader, ASYS develops and manufactures process and line solutions for many of the world’s most successful companies. As a turnkey solution provider, we offer integrated, customized concepts with a guaranteed future from a single source. Our software platform SynapticaOS rethinks industrial software and thus shapes the future of industrial manufacturing.