Vesta Microsystem is dedicated to developing & enabling IP-owned iTGV technology into semiconductor advanced packaging sector by high-accuracy & UPH LIDE (Laser Induced Deep Etching) hole, Direct-Cu microvia metallization (aspect ratio : ~10) & fine line RDLs and also committed to act as a partnered solution provider of semiconductor iTGV substrate. Why Vesta iTGV ? – Leading LIDE Through Hole Formation (accu. +/- 2um ; > 80% straight hole) – Quasi-Isotropic Conformal Coverage(PVD) for High AR Hole (~10) – SeWaRe (glass cracking) Prevention – Total Solution for Dense RDLs Built on iTGV Core
Universal Instruments Corp.
Universal Instruments is a global leader in advanced automation assembly, empowering manufacturers to build smarter, faster, and more reliably. Our solutions span intelligent surface mount platforms, advanced semiconductor packaging, industry-leading through-hole systems, and flexible automation for complex assemblies. Combined with powerful line software, expert global services, and a world-class process laboratory, we help customers overcome today’s toughest manufacturing challenges and stay competitive in a rapidly evolving market.
Microcosm Technology Co., Ltd.
Microcosm Technology is a publicly listed advanced materials company based in Taiwan, with over 20 years of experience in functional polymer and polyimide materials. We provide materials for advanced packaging, semiconductor, PCB/FPCB, and flexible electronics applications, including RDL dielectrics (PSPI, PSPBO), SAP/m-SAP build-up materials, high-frequency dielectrics, peelable PSPI, FCCL, coverlay, bonding sheets, and transparent polyimide. With 100% in-house R&D and a global patent portfolio, we partner closely with customers to support NPI and high-volume manufacturing.
Koh Young Technology, Inc.
Koh Young helps manufacturers prevent defects, stabilize processes, and increase throughput. Since 2002, it has led the True3D measurement-based inspection market, starting with the industry’s first 3D SPI using patented Moiré technology. Today it delivers solutions for PCBA, machining, press-fit and through-hole pins, dispensed materials, and semiconductor packaging. Continuous innovation and customer-focused R&D fuel its leadership. With global teams, Koh Young provides local support, training, and process expertise that turn inspection data into AI-powered, closed-loop decisions.
Elephantech Inc
Elephantech Inc. is a Tokyo-based deep-tech company pioneering copper nanoparticle materials and inkjet-based additive manufacturing. At IPC APEX, Elephantech highlights three core technologies: Self-Assembled Copper Nanoparticles (SA-CuNP) that enable high-performance copper pastes without organic dispersants; a novel HDI microvia formation process using copper nanoparticle ink and reduction, delivering palladium-free, void-free vias; and SustainaCircuits™, a pure additive PCB manufacturing platform supported by ELP04 inkjet equipment for low-carbon, high-density PCB production.
Dongguan Link Equipment Co., Ltd.
Dongguan Link Equipment Co., Ltd. delivers one-stop SMT production line solutions and professional services. Based in Dongguan (near Shenzhen Airport & Hong Kong), it offers timely support for global clients. It provides quality SMT equipment (printers, SPI/AOI inspectors, etc.) and cost-effective R&D products (loaders, SMD counters, etc.) to cut costs and boost efficiency. Backed by stable supplier partnerships, it ensures supply stability with competitive prices. Adhering to customer-centric principles, it offers end-to-end support as a reliable SMT partner.