About

About X2F X2F designs and builds advanced molding machines based on a breakthrough extrude to fill technology that leverages controlled viscosity and a patented pulse packing process. By operating at significantly lower pressures than conventional injection molding, X2F enables customers to mold advanced materials previously thought impossible to process and to achieve complex geometries with greater precision and efficiency. At PTXPO, X2F will showcase live machine demonstrations and real world applications that highlight how data driven injection molding is transforming manufacturing. Attendees can connect directly with X2F experts, explore active customer use cases, and see firsthand how the technology unlocks new levels of design freedom and manufacturing efficiency. X2F, based in Loveland, Colorado, sells a new category of molding technology which leverages controlled viscosity molding (CVM), a patented low velocity pulse-packing process that supports overmolding and encapsulation of PCB's (like BMS boards), batteries, connectors, and motors. Overmolding and encapsulation of electronic components provides significant improvements to the durability and performance of electronic parts. X2F has financial backing from Atlas Innovate with senior advisors that include the former CEOs of General Motors and Dow Chemical. For more information, visit www.x2f.com X2F, based in Loveland, Colorado, sells a new category of molding technology which leverages controlled viscosity molding (CVM), a patented low velocity pulse-packing process that supports overmolding and encapsulation of PCB's (like BMS boards), batteries, connectors, and motors. Overmolding and encapsulation of electronic components provides significant improvements to the durability and performance of electronic parts. X2F has financial backing from Atlas Innovate with senior advisors that include the former CEOs of General Motors and Dow Chemical. For more information, visit www.x2f.com