Shenzhen Goldlink Tongda Electronics Co., Ltd.
Baoan, China
Overview
Company details and contact information.
About
About Shenzhen Goldlink Tongda Electronics Co., Ltd. GLPOLY is a China-based company focusing on development of thermal interface materials.It is the most influential new material development enterprise in China’s TIM sector. GLPOLY is committed to providing customers with advanced thermal interface materials and innovative thermal management solution for solving thermal management challenges of today’s advanced innovative products.GLPOLY has provided thermal interface materials for top class clients such as DJI,NIO,Motor. Market orientation,serving leading clients, upholding positive R&D and mastering core technology are the strategies for the long-term sustainable development of GLPOLY. GLPOLY is a China-based company focusing on development of thermal interface materials.It is the most influential new material development enterprise in China’s TIM sector. GLPOLY is committed to providing customers with advanced thermal interface materials and innovative thermal management solution for solving thermal management challenges of today’s advanced innovative products.GLPOLY has provided thermal interface materials for top class clients such as DJI,NIO,Motor. Market orientation,serving leading clients, upholding positive R&D and mastering core technology are the strategies for the long-term sustainable development of GLPOLY.
- Website
- https://glpoly.com
- Phone
- +867 552 757 9310
- Address
- Rm616, 619 Huafeng Xinan Commercial Building, Block 45, Baoan 518101, China
Products
Products and media connected to this company.
Thermal Gel （silicone/Non-silicone）
The series of thermal gel are single-component packaged, produced automatically, resistant to high temperature, and non-corrosive to metals. The XK-G series is ...
Two-component thermal gap filler （silicone）
S-Series two-component thermal conductive gel is a gap-filling material that can cure at room temperature or high temperatures. It exhibits thixotropic behavior...
Thermal conductivity structural adhesive (modified epoxy)
The series of thermal conductive structural adhesives are suitable for applications in the field of power batteries. The thermal conductivity ranges from 1.2 to...
Thermal Pad （silicone/Non-silicone）
Thermal pad series are made from a flexible and highly deformable material, making them suitable for large structural design tolerances. The surface or inner la...
People
Contacts connected to this company.