A provider of component level Value Add Services that meet or exceed industry standards. We do what is needed and adjust to our ever-changing electronics marketplace. Services include – State of the Art Robotic mitigation services, XRF analysis, Gold Removal, Solderability enhancement, Testing, BGA repair and reball, Lead Form and excise, Surface mount tape and reel, Thru-hole tape and reel, Moisture removal, Dry-package, Cleanliness, XRF, Solderability – J-STD, Mil-STD, GEIA, EIA, AS9100 Rev. D, SDVOSB
Parter
Parter is an AI-powered platform for electronics companies that transforms component and supply-chain data into real-time, actionable decisions. We help hardware organizations reduce risk, cost, shortages, and delays by continuously monitoring every part in their Bill of Materials (BOM) across lifecycle, availability, pricing, and compliance.
Banyan.eco
Banyan.eco is an AI-driven electronics intelligence platform. Specific to the electronics industry, it massively reduces the burden on industry professionals for compliance and product carbon footprints. It moves as fast as your supply chain, across parts, regulations, and global risks to support supply chain resilience, product compliance and sustainability.
Alltemated Inc.
Since 1993, Alltemated Inc. has led the Electronic Manufacturing industry with value-added services and our PLACE-N-BOND Underfilm Adhesive. We provide Tape and Reel, IC Programming, Laser Marking, Lead Trim/Form, and other assembly services, plus standard and custom carrier tapes. ISO 9001:2015 and Chicago-based, we offer unique underfilm technology that eliminates dispensing and curing underfills and enhances components’ mechanical strength to their substrate. Originally invented for corner-edge bonding of BGA/CSP/LGA packages, it has expanded to a variety of additional applications.
