Company Category: Co-packaged Optics

Sivers Semiconductors

Sivers Semiconductors develops high-power CW DFB laser chips and arrays for AI, HPC, and optical interconnects. Designed for pluggable modules, co-packaged optics, and silicon photonics platforms, our CW-WDM MSA-compliant lasers deliver high-volume scalability, lower power consumption, and reliable performance in demanding environments. | Sivers Wireless delivers advanced mmWave RFICs, analog beam-former ICs, and integrated RF modules for 5G and 6G, and satellite and network applications. Designed for high-frequency satcom challenges, our solutions provide high output power and efficiency to extend link range, reduce array size and power consumption, and enable reliable connectivity across dynamic LEO operations. Low-noise receive chains and agile electronic beam steering improve spectral efficiency, reliability, and system cost across multi-satellite networks.

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Silux Technologies Co.,Ltd

SiLUX Technologies Co., Ltd. (SiLux) is a leading provider of advanced silicon photonics solutions, specializing in high-performance photonic integrated circuits (PICs) and optical engines tailored for large-scale AI clusters, next-generation data centers, and telecom applications.

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Silex Microsystems

We are a pure-play MEMS Foundry. New process development requires deep knowledge and manufacturing expertise when an optical device starts from Concept to volume production. The industry’s most extensive line of MEMS manufacturing capabilities and our team of experts will accelerate your project from inception to qualified production. | We are a pure-play MEMS Foundry. New process development requires deep knowledge and manufacturing expertise when an optical device starts from Concept to volume production. The industry’s most extensive line of MEMS manufacturing capabilities combined with our team of experts will bring your project from inception to qualified production sooner.

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Sigurd Microelectronics Corp

Sigurd Microelectronics is a top-10 global OSAT provider specializing in AI, optical communication, and automotive sectors. Driven by its “3A IC Strategy”—Advanced Test, Automation, and AI Smart Factories—it delivers comprehensive packaging and testing solutions across Taiwan, China, and Japan.

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Shenzhen Photonics Valley Technology Co., Ltd.

Independent development and manufacturing of glass-based TGV optoelectronic interposer,3D optical waveguide chip and CPO advanced packaging, enable high speed optical communication and cluster optical interconnection for artificial intelligent computing.

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Shenzhen Optical Network Telecom Co., Ltd.

ONTTX is a manufacturer focused on fiber optics. Not only for the traditional fiber optics product, but also our pioneering High Fiber Count Engineering Excellence can help customer on high-density, high bandwidth application such as OXC, CPO and generative AI data center cluster.

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Shanghai Beeplux Semiconductor Technologies

Beeplux unveils high-performance silicon photonics engines for AI data centers, supporting 400G/800G with LPO-optimized, low-power architectures. Additionally, their 8×8 Optical Circuit Switch (OCS) offers a non-blocking, hot-swappable design with low insertion loss and fast switching, ensuring reliable, high-bandwidth interconnects for ultra-large-scale AI clusters.

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SemiNex Corporation

SemiNex designs and manufactures high power semiconductor infrared laser diodes and optical amplifiers for optical communications, LiDAR, defense, and medical applications. Our lasers are based on advanced quantum structures and high quality materials from 1250 nm to 1940 nm, and deliver superior thermal and electrical efficiencies with excellent optical power. | SemiNex designs and manufactures high power semiconductor infrared laser diodes and optical amplifiers for Data Centers and Optical Networks. Our lasers are based on advanced quantum structures and proprietary designs from 1270 nm to 1940 nm, and deliver superior thermal and electrical efficiencies with excellent optical power.

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SCIL Nanoimprint Solutions

SCIL Nanoimprint Solutions, a Philips spin-out based in The Netherlands, provides high-volume nanoimprint lithography equipment, processes and materials for nanometer-scale precision manufacturing of photonics and optics, enabling next-generation applications such as Optical I/O, AI data center interconnects, and ultra-compact optical elements for mobile and augmented reality devices.

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Sanmina

Sanmina’s PCB Division delivers advanced printed circuit board solutions supporting high-reliability, high-complexity applications across medical, aerospace, defense, industrial, automotive, and communications markets. Quick-turn prototyping, high-volume production, advanced HDI, rigid-flex, and complex multilayer boards. Backed by global manufacturing scale, strict quality standards, and deep engineering expertise, Sanmina helps customers accelerate innovation, improve yields, optimize cost, and bring mission-critical products to market faster and more reliably. | Sanmina’s Medical Division is one of the world’s largest providers of finished medical electronic products to original equipment manufacturers. The company offers complete, end-to-end integrated manufacturing services and a full range of products from small devices to large, complex equipment. Sanmina’s 21 facilities are ISO 13485:2003 certified, nine of which are FDA registered. | Sanmina’s Advanced Microsystems Technologies division leverages more than 30 years of domain experience in providing integrated Optical Microelectronics technology design with best-in-class advanced global manufacturing solutions to enable our customer’s products. We offer services from design concept through volume manufacturing. AMT continuously invests in state-of-the-art assembly technologies. | Advanced Microsystems Technologies is Sanmina’s Optical, RF and Micro-electronics division that leverages over 30 years of experience providing mixed technology design, development and advance manufacturing services. AMT continuously invests in assembly technology capabilities to provide state-of-the-art solutions to the communications, HPC, Datacenter, AI, Co-packaged optics, medical, automotive and industrial markets.

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